CDR05BP101BBSP功能参数封装等资料
元器型号: CDR05BP101BBSP
元器件品牌: KEMET[Kemet Corporation]
封装:
功能描述: 55681
引脚数量:
适应温度: 最小 °C | 最大 °C
文件大小: KB
- CDR05BP101ABSM
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABSP
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABSR
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABUM
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABUP
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABUR
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABWM
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABWP
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ABWR
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACSM
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACSP
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACSR
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACUM
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACUP
CERAMIC CHIP/MIL-PRF-55681 - CDR05BP101ACUR
CERAMIC CHIP/MIL-PRF-55681