CDR06BP129BBSP功能参数封装等资料
元器型号: CDR06BP129BBSP
元器件品牌: KEMET[Kemet Corporation]
封装:
功能描述: 55681
引脚数量:
适应温度: 最小 °C | 最大 °C
文件大小: KB
- CDR06BP129ABSM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABSP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABSR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABUM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABUP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABUR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABWM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABWP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ABWR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACSM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACSP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACSR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACUM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACUP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BP129ACUR
CERAMIC CHIP/MIL-PRF-55681