CDR06BX101BCSP功能参数封装等资料
元器型号: CDR06BX101BCSP
元器件品牌: KEMET[Kemet Corporation]
封装:
功能描述: 55681
引脚数量:
适应温度: 最小 °C | 最大 °C
文件大小: KB
- CDR06BX101ABSM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABSP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABSR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABUM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABUP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABUR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABWM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABWP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ABWR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACSM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACSP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACSR
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACUM
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACUP
CERAMIC CHIP/MIL-PRF-55681 - CDR06BX101ACUR
CERAMIC CHIP/MIL-PRF-55681