CXK77B3611AGB-功能参数封装等资料
元器型号: CXK77B3611AGB-
元器件品牌: Sony Corporation
封装:
功能描述:
引脚数量:
适应温度: 最小 °C | 最大 °C
文件大小: KB
- CXK77B3610GB
High Speed Bi-CMOS Synchronous Static - CXK77B3610GB-
High Speed Bi-CMOS Synchronous Static - CXK77B3610GB-6
High Speed Bi-CMOS Synchronous Static - CXK77B3610GB-7
High Speed Bi-CMOS Synchronous Static - CXK77B3611-5
x36 Synchronous SRAM - CXK77B3611-6
x36 Synchronous SRAM - CXK77B3611-7
x36 Synchronous SRAM - CXK77B3611AGB
High Speed 1MBit Bi-CMOS Synchronous Static RAM(????M????i-CMOS???????AM) - CXK77B3611AGB-
High Speed Bi-CMOS Synchronous Static - CXK77B3611AGB-5
High Speed Bi-CMOS Synchronous Static - CXK77B3611AGB-6
High Speed Bi-CMOS Synchronous Static - CXK77B3611AGB5
From datasheet system