CXK79M36C162GB-33功能参数封装等资料
元器型号: CXK79M36C162GB-33
元器件品牌: SONY[Sony Corporation]
封装:
功能描述: 18mb512kb
引脚数量:
适应温度: 最小 °C | 最大 °C
文件大小: KB
- CXK79M36C160GB
MEMORY-SigmaRAM 16Meg 1x1 HSTL I/O (512K x 36) (27 pages 364K Rev. 7/6/01) - CXK79M36C161GB
MEMORY-SigmaRAM 16Meg 1x1 LVCMOS I/O (512K x 36) (27 pages 364K Rev. 7/6/01) - CXK79M36C162GB
18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb - CXK79M36C162GB-33
18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb - CXK79M36C162GB-4
18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb - CXK79M36C162GB-5
18Mb 1x2Lp HSTL High Speed Synchronous SRAMs (512Kb - CXK79M36C163GB
MEMORY-SigmaRAM 16Meg 1x2 LVCMOX I/O (512K x 36) (25 pages 360K Rev. 7/6/01) - CXK79M36C164GB
18Mb 1x1Dp HSTL High Speed Synchronous SRAMs (256Kb 512Kb - CXK79M36C165GB
18Mb 1x1Dp LVCMOS High Speed Synchronous SRAMs (256Kb 512Kb